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The bonder is without causing any damage to the device or the base board.SENPUM Ultra-high Precision Laser Displacement Sensor LM-N Series It can suck up the device stably, quickly, completely and correctly, and mount the device on the specified position quickly and accurately, which has been widely used in military industry, home appliance, communication, computer and other industries.
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Room 2905, Building A, Yangguang Kechuang Center, Nanxin Road, Nanshan District, Shenzhen, Guangdong, China
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