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Elimination of static electricity generated during transport of substrates

Eliminates static electricity generated during transport of substrates
Inspection of PCB boards

Line spot inspection of PCBs without the influence of wisps.
Bonder Inspection

Controlling the height of the bonder's inspection head
Substrate Assembly Inspection

Assembly testing of substrates
Monitor Chip

Monitor chip slips out of cassette
Inspection of electronic components

Remote detection of the presence or absence of electronic components

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